Encapsulation Molding, Over Molding & Insert Molding

Encapsulation molding, insert molding, and over-molding are core competencies at PILLER AIMMCO. We have completed hundreds of successful projects with parts incorporating multiple shots over a variety of substrates including metal, plastic, fabrics, and more recently, electronics.

With the increasing miniaturization of micro-electronics and the expanding desire for interconnectivity, more and more products are being developed that involve the encapsulation molding, insert molding, or over-molding of electronics. PILLER AIMMCO has been at the forefront of this development, collaborating with product design companies, engineering firms, start-ups, and Fortune 100 OEMs to develop strategies enabling the over-molding of populated PCBs, flexible circuits, and electro-mechanical assemblies.

Contact us to discuss your encapsulation molding, over-molding, or insert molding requirements. We welcome the opportunity to bring our expertise to your next project!

Our Insert, Over & Encapsulation Molding Processes

Over-molding, insert molding, and encapsulation molding are complex processes used to mold plastic around or over a variety of substrates, such as metals, plastics, assemblies, and electronics. These processes can be performed as a single shot of plastic onto the substrate, or as a multiple-shot process using multiple thermoplastic materials.

Over-molding, insert molding, and encapsulation molding are quite common for products and components in all industries. These processes allow for unique features and benefits such as:

Tactile soft-touch finishes
Multiple colors or color effects
Protection from dust and liquids
Vibration and shock protection
Elimination of secondary assembly processes
Reduced part counts

Product Design & Injection Mold Manufacturing Considerations

The primary challenges in developing insert, encapsulation, or over-molded components are part geometry and tooling design. The substrate being over-molded must be consistent in size, with particular attention paid to the areas being sealed during the over-mold shot. Typical tolerance requirements for these features are within ±0.001”, with exceptions for softer substrates that can tolerate some amount of “crush”. The substrate geometry must also be carefully considered in order to establish how best to seal its’ surface against the pressure of the over-mold shot, how to support areas that cannot be backed by tool steel, and to provide optimized gate locations.

Because of the many nuances involved, an iterative tooling approach is commonly required to achieve the best results, and with our vertically integrated manufacturing operations, we excel at these activities. With all injection mold manufacturing and modifications performed in-house, driven by our engineering team and carried out in a matter of hours or days, not weeks, we routinely take on challenging projects involving feature sets that our competitors won’t attempt.

We approach all overmolding, insert molding, and encapsulation molding projects with a collaborative mind set, and have a long history of success in pushing the envelope of what is possible with the injection molding process.

Contact PILLER AIMMCO to discuss over, insert, or encapsulation molding for your products.